Effect of inductively coupled plasma damage on performance of GaN–InGaN multiquantum-well light-emitting diodes

Abstract

InGaN multiquantum-well light-emitting diodes (LEDs) in the form of unpackaged die with emission wavelengths from 420to505nm were exposed to either Ar or H2 inductively coupled plasmas as a function of both rf chuck power (controlling incident ion energy) and source power (controlling ion flux). The forward turn-on voltage is increased by both types of plasma exposure and is a function of both the incident ion energy and flux. The reverse bias current in the LEDs is much larger in the case of H2 plasma exposure, indicating that preferential loss of nitrogen leads to increased surface leakage. The current transport in the LEDs is dominated by generation-recombination (ideality factor ∼2) both before and after the plasma exposures.