Chemical mechanical polishing by colloidal silica-based slurry for micro-scratch reduction

Application of Chemical Mechanical Polishing to the Fabrication of VLSI Circuit Interconnections

W. Patrick, W. L. Guthrie, C. L. Standley et al. · Journal of The Electrochemical Society · 1991 · 237 citations

Engineering, Electrical Engineering, Materials Science +17

Effect of Particle Size of Chemical Mechanical Polishing Slurries for Enhanced Polishing with Minimal Defects

G. Bahar Basim, J. Adler, Uday Mahajan et al. · Journal of The Electrochemical Society · 2000 · 198 citations

Engineering, Chemical Engineering, Materials Science +13

Effects of abrasive size distribution in chemical mechanical planarization: Modeling and verification

Jianfeng Luo, David Dornfeld · IEEE Transactions on Semiconductor Manufacturing · 2003 · 183 citations

Engineering, Materials Engineering, Materials Science +15

Abrasive-Free Polishing for Copper Damascene Interconnection

Seiichi Kondo, Noriyuki Sakuma, Yoshio Homma et al. · Journal of The Electrochemical Society · 2000 · 96 citations · Full text

Engineering, Materials Engineering, Materials Science +16

Mechanics of Polishing

Vispi H. Bulsara, Yoomin Ahn, Srinivasan Chandrasekar et al. · Journal of Applied Mechanics · 1998 · 47 citations

Engineering, Materials Engineering, Materials Science +17