Recent Advances in Machining of Silicon Wafers for Semiconductor Applications

Ductile-Regime Grinding: A New Technology for Machining Brittle Materials

Thomas G. Bifano, T. A. Dow, R.O. Scattergood · Journal of Engineering for Industry · 1991 · 1.1K citations

Engineering, Manufacturing Engineering, Materials Science +12

The hardness of solids

D. Tabor · Reviews of Physics in Technology · 1970 · 616 citations

Natural Sciences, Materials Engineering, Materials Science +17

Mirror Surface Grinding of Silicon Wafers with Electrolytic In-Process Dressing

H. Ohmori, Tomoyuki Nakagawa · CIRP Annals · 1990 · 331 citations

Engineering, Manufacturing Engineering, Materials Engineering +16

Technological Advances in Fine Abrasive Processes

R. Komanduri, D.A. Lucca, Yukako Tani · CIRP Annals · 1997 · 310 citations

Engineering, Materials Engineering, Materials Science +14

Diamond Turning of Brittle Materials for Optical Components

Tomoaki Nakasuji, Sunao KODERA, Seiichiro Hara et al. · CIRP Annals · 1990 · 256 citations

Natural Sciences, Materials Engineering, Materials Science +11