The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect - Concepedia

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The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect

14

Citations

26

References

2014

Year

Ki-Yeung Mun, Tae Eun Hong, Taehoon Cheon, Yujin Jang, Byoung-Yong Lim, Sunjung Kim

Thin Solid Films

Materials ScienceRu Thin FilmsEngineeringDiffusion ResistanceSurface ScienceApplied PhysicsThin FilmsNitrogen IncorporationAtomic LayerChemical Vapor DepositionThin Film Processing

References

	Year	Citations

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