Ultrashort pulsed laser ablation of diamond

Abstract

Laser processing of diamond and chemical-vapor-deposited diamond thin films are important in the microelectronics and cutting tool industries because the manufacture of diamond films with low surface roughness and complex shapes has proven to be difficult. In this paper we present a review of current laser polishing and ablation processes followed by a discussion of ultrashort pulsed processing of diamond. Compared with the use of longer pulsed lasers, the use of 248-nm, 500-fs duration pulses at extreme intensity offered multiple advantages, including a lack of lateral thermal damage and significant improvements in the structural purity of the ablated surface. Experimental data, including Raman spectra and scanning electron micrographs, were presented to demonstrate the superior capabilities of this new class of lasers for diamond processing.