A mechanism of diamond-abrasive finishing of monocrystalline silicon carbide

Abstract

The investigation of the mechanism of diamond-abrasive finishing of monocrystalline silicon carbide on the basis of a generalized model of formation and removal of debris particles and material removal has demonstrated that the use of specific value of the energy of transfer as a criterion for the assessment of machining efficiency permits substantiating suitability of boron carbide and titanium dioxide powders for fine grinding and of chromium oxide, alumina, ceric oxide, and ASM 2/1 diamond micron powders for ultrafine grinding.