2007 · 35 citations · 2 references
EngineeringElectrical EngineeringElectronic MaterialsMicroelectronicsSemiconductor DevicesDevice CharacterizationHigh-frequency Semiconductor DevicesHigh-temperature MaterialsSemiconductor ReliabilityWide-bandgap Semiconductor DevicesWide-bandgap SemiconductorsActivation EnergyCompressionDevice DegradationGallium Nitride (Gan) MaterialsGan-based High-frequency DevicesHigh-temperature Device OperationHigh-temperature ElectronicsHigh-temperature Testing
This work reports the results of the first three temperature accelerated RF life test on millimeter-wave GaN heterostructure field effect transistors (HFETs) at 10 GHz. 2times100 mum transistors were stressed at 2 dB compression with a pre RF bias condition of I <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ds</sub> = 100 mA/mm and V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ds</sub> = 25 V. The three channel temperatures used in study were 285 degC, 315 degC and 345 degC. An activation energy of 1.80 eV was extracted giving a MTTF at T <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ch</sub> = 125 degC of 3.5times10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">9</sup> hours.
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30-W/mm GaN HEMTs by Field Plate Optimization
Yifeng Wu, A. Saxler, M. Moore et al. · IEEE Electron Device Letters · 2004 · 1.1K citations