Design and fabrication of organic complementary circuits

Abstract

We have used a simple model description of single field effect transistor characteristics to design organic complementary circuits ranging in complexity from simple inverters through 48-stage shift registers and three-bit row decoders. The circuits were fabricated using standard silicon photolithographic techniques to define the metal, insulator, and interconnect levels. The ohmic source and drain contacts and part of the interconnect metallization were formed by electroless/immersion deposition of Ni-P/Au on prepatterned TiN. The n-type and p-type organic semicondcutors were evaporated onto these substrates to complete the circuits. Measured circuit characteristics were in reasonable agreement with simulations based on the simple device model.