Advanced setup for thermal cycling of power modules following definable junction temperature profiles

Abstract

In this paper a setup for performing power cycling tests of IGBT modules for the purpose of reliability analysis is presented. The main purpose of the setup is to provide experimental data for the parameterization and verification of a newly developed physical model of solder deformation leading to the failure of power electronic devices. The design procedure, including considerations of reliability, measurement, and cooling, for a 5 kW flexible power cycling system is presented. Experimental results of a sub-1 kW prototype setup are shown, demonstrating the ability of the system to force the junction temperature of the device under test to follow an arbitrary temperature profile.