Heat transfer modeling for surface crack depth evaluation

Abstract

This paper presents a theoretical approach for the quantitative depth evaluation of linear opened surface cracks by using lock-in infrared thermography. In order to simulate heat flow near a crack, a three-dimensional simulation model has been developed by using finite element simulation. We show that, under a periodic local thermal excitation in the vicinity of the crack, the second spatial derivative of the amplitude image can provide information on this depth. The influence of the simulation parameters are discussed for the optimal characterization of defects.