Linear thermal expansion coefficient and biaxial elastic modulus of diamondlike carbon films

Abstract

Diamondlike carbon films were deposited on silicon, gallium arsenide and aluminum substrates using ion-assisted chemical vapor deposition. The stress of these films was measured as a function of temperature between 25 and 150 °C. Using the stress-temperature measurements, the average linear thermal expansion coefficient was found to be 2.3 ppm/°C, while the biaxial elastic modulus 1.74×1011 Pa.