Recent progress in pulse reversal plating of copper for electronics applications

Abstract

AbstractAbstractBased on demands for modern printed circuit board (pcb) manufacturing, the copper electroplating process is discussed. Electroplating from an additive free solution using low frequency pulse reversal plating with superimposed cathodic pulsation is suggested, which meets the demands for precise dimensions, high ductility and conductivity, low costs and environmental friendliness.Keywords: COPPERPACKAGINGELECTROPLATINGPRINTED CIRCURT BOARDMICROELECTRONICS