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Effects of Zn addition on electromigration behavior of Sn–1Ag–0.5Cu solder interconnect

Materials ScienceElectrical EngineeringElectromigration TechniqueEngineeringElectromigration BehaviorApplied PhysicsElectronic PackagingZn AdditionMicroelectronicsSn–1ag–0.5cu Solder InterconnectInterconnect (Integrated Circuits)