Publication | Closed Access
Semiconductor Surface Roughness: Dependence on Sign and Magnitude of Bulk Strain
255
Citations
20
References
1994
Year
EngineeringThin Film Process TechnologySemiconductorsSemiconductor Surface RoughnessBulk StrainThin Film ProcessingMaterials SciencePhysicsCrystalline DefectsSurface RoughnessSemiconductor MaterialSurface CharacterizationDislocation InteractionSurface ScienceApplied PhysicsMolecular Dynamics SimulationsThin FilmsMechanics Of MaterialsHigh Strain Rate
Changes in surface roughness have been studied as a function of bulk compressive and tensile strains (biaxial in the plane of the sample surface) in thin films of compositionally uniform and dislocation-free ${\mathrm{Ge}}_{0.5}$${\mathrm{Si}}_{0.5}$. A pronounced surface roughness is observed only for films under compressive strains exceeding 1.4%. Molecular dynamics simulations show that this striking result has its origin in the strain-induced lowering of surface step free energies.
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