An Efficient Metal-Core Printed Circuit Board With a Copper-Filled Through (Blind) Hole for Light-Emitting Diodes

Abstract

A Cu-filled through (blind) hole was formed in a metal-core printed circuit board (MCPCB) by drilling a hole underneath the chip pad, followed by hole filling using copper electroplating. This Cu-filled through (blind) hole acts as a superior heat-dissipation route, which directly and efficiently removes the heat generated by the light-emitting diode (LED) chip. Compared with a conventional MCPCB, the MCPCB with a Cu-filled through (blind) hole significantly reduces the peak surface temperature of the LED chip from 46 °C to 39 °C and the total thermal resistance from 8.9 to 2.8 K/W.