Options for additive rapid prototyping methods (3D printing) in MEMS technology

TLDR

This study investigates additive rapid prototyping options for MEMS and outlines future directions such as material compatibility, wafer‑level printing, conductive materials, and finer resolution to broaden device applications. The authors review SLA, FDM, and SLS 3D‑printing technologies, compare their resolution to traditional MEMS fabrication, and describe building entire assemblies directly from software files without extra processing. The review shows that additive manufacturing can simplify microfabrication, shorten prototype cycles, and is especially suited for microfluidic and lab‑on‑a‑chip devices with 50–500 µm features, highlighting its commercial potential.

Abstract

Purpose – This study aims to investigate the options for additive rapid prototyping methods in microelectromechanical systems (MEMS) technology. Additive rapid prototyping technologies, such as stereolithography (SLA), fused deposition modeling (FDM) and selective laser sintering (SLS), all commonly known as three-dimensional (3D) printing methods, are reviewed and compared with the resolution requirements of the traditional MEMS fabrication methods. Design/methodology/approach – In the 3D print approach, the entire assembly, parts and prototypes are built using various plastic and metal materials directly from the software file input, completely bypassing any additional processing steps. The review highlights their potential place in the overall process flow to reduce the complexity of traditional microfabrication and long processing cycles needed to test multiple prototypes before the final design is set. Findings – Additive manufacturing (AM) is a promising manufacturing technique in micro-device technology. Practical implications – In the current state of 3D printing, microfluidic and lab-on-a-chip devices for fluid handling and manipulation appear to be the most compatible with the 3D print methods, given their fairly coarse minimum feature size of 50-500 μm. Future directions in the 3D materials and method development are identified, such as adhesion and material compatibility studies of the 3D print materials, wafer-level printing and conductive materials development. One of the most important goals should be the drive toward finer resolution and layer thickness (1-10 μm) to stimulate the use of the 3D printing in a wider array of MEMS devices. Originality/value – The review combines two discrete disciplines, microfabrication and AM, and shows how microfabrication and micro-device commercialization may benefit from employing methods developed by the AM community.