Applied Physics Letters · 2004 · 54 citations · 16 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsCarrier TransportDopingIii-v SemiconductorsSemiconductor Device MaterialsSemiconductor PhysicsWide-bandgap SemiconductorsEpitaxial Growth Of Wide-bandgap SemiconductorsGallium NitrideGallium Nitride (Gan) MaterialsLiquid-phase ReactionsMolecular Beam EpitaxyP-type DopingResistivitySecondary Ion Mass Spectrometry
In this paper we report on the mechanism of efficient incorporation of Mg in GaN films during growth by plasma-assisted molecular beam epitaxy. It is found that Mg incorporates more efficiently during growth of GaN films at high temperatures (770 °C) under extreme Ga-rich conditions. We propose that this result is due to the dissolution of Mg in the excess Ga on the growth surface and its incorporation into the GaN film via liquid-phase processes. Transport measurements at 300K together with secondary-ion-mass-spectroscopy indicate that the Mg-doping efficiency of GaN under these conditions of growth is 10%. Using this method of doping, p-type GaN films free of Ga droplets, with hole concentrations varying from 2×1017 to 3×1018cm−3 and corresponding mobilities varying from 30 to 2cm2∕Vs, are obtained. The lowest resistivity achieved is 0.3 Ω cm.
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Thermal Annealing Effects on P-Type Mg-Doped GaN Films
Shuji Nakamura, Takashi Mukai, Masayuki Senoh et al. · Japanese Journal of Applied Physics · 1992 · 1.1K citations
Hole Compensation Mechanism of P-Type GaN Films
Shuji Nakamura, Naruhito Iwasa, Masayuki Senoh et al. · Japanese Journal of Applied Physics · 1992 · 1.1K citations
On <i>p-</i>type doping in GaN—acceptor binding energies
Stefan Fischer, Christian Wetzel, E. E. Häller et al. · Applied Physics Letters · 1995 · 262 citations