Publication | Closed Access
GaN on Si Substrate with AlGaN/AlN Intermediate Layer
202
Citations
13
References
1999
Year
Materials ScienceWide-bandgap SemiconductorElectrical EngineeringSi SubstrateEngineeringNanoelectronicsCategoryiii-v SemiconductorApplied PhysicsAluminum Gallium NitrideSharp Band-edge EmissionGan Power DeviceMicroelectronicsOptoelectronicsSi-doped FilmIntermediate Layer
A single crystal GaN thin film was successfully grown on a Si (111) substrate by means of atmospheric pressure metalorganic chemical vapor deposition. Though there is a large difference in thermal expansion coefficients between GaN and Si, an intermediate layer consisting of AlN and AlGaN improved the quality of GaN on Si and reduced meltback etching during growth. Pits and cracks were not observed on the substrate and a mirror-like surface was obtained. The full-width at half maximum (FWHM) of the double-crystal X-ray rocking curve for GaN(0004) was 600 arcsec. Photoluminescence measurement at room temperature for a Si-doped film revealed a sharp band-edge emission with a FWHM of 62.5 meV, which is the narrowest value reported to date.
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