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A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization

Materials ScienceMaterials EngineeringSinteringEngineeringMicrofabricationNanotechnologyNanomaterialsMechanical EngineeringApplied PhysicsMechanical PerformancesChip AttachmentHigh-performance MaterialSubstrate MetallizationMetallic NanomaterialsElectronic PackagingPreliminary StudyMicrostructureMetal Processing