Study of Bonding Technology Using Silver Nanoparticles

Abstract

We investigated a new bonding technique utilizing nano-scaled particles for use in high-temperature environments. The results of our investigations revealed that the method could be used to form bonds by simultaneously applying heat and pressure. Moreover, compared to a conventional Pb–5Sn-solder bond, a nanoparticle-based bond suffered no degradation in bonding strength over an elevated-temperature holding period of 1000 h at 250 °C, and its discharge characteristics were improved (i.e., increased) threefold. It is possible to extend this bonding technique to mounting components in devices that operate in high-temperature environments, e.g., it can be used to mount components such as silicon carbide (SiC) devices, which are expected to be applied in environments with temperatures exceeding 250 °C.