2012 · 19 citations · 4 references
EngineeringElectrical EngineeringOptoelectronicsSemiconductor DevicesSemiconductor MaterialsIii-v SemiconductorsIntegrated Circuit DesignIntegrated Circuit DevicesIntegrated PhotonicsOptical AmplifiersPhotonic Integrated CircuitsDie-to-wafer BondingIntegrated Optical AmplifiersIntegrated Waveguide CircuitsIntegrated WaveguidesOptical Amplifier DesignPower ConsumptionSemiconductor Optical AmplifiersWafer-to-wafer Bonding
A heterogeneously integrated III-V-on-silicon optical amplifier utilizing an ultra-thin DVS-BCB die-to-wafer bonding process is reported. A novel design exploiting high confinement in the active waveguide is demonstrated showing low power consumption operation. 13dB on-chip gain is achieved for 40mA drive current at room temperature.
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III‐V/silicon photonics for on‐chip and intra‐chip optical interconnects
Günther Roelkens, L. Liu, Di Liang et al. · Laser & Photonics Review · 2010 · 529 citations
427 Gbit/s electro-optic modulator in silicon technology
L. Alloatti, D. Korn, R. Palmer et al. · Optics Express · 2011 · 195 citations · Full text
A Hybrid AlGaInAs–Silicon Evanescent Amplifier
Hyundai Park, Alexander W. Fang, Oded Cohen et al. · IEEE Photonics Technology Letters · 2007 · 149 citations