Publication | Closed Access
ESD sensitivity and VLSI technology trends: thermal breakdown and dielectric breakdown
32
Citations
24
References
1994
Year
Electrical EngineeringEngineeringBias Temperature InstabilityEsd SensitivityTime-dependent Dielectric BreakdownCircuit ReliabilityElectronic PackagingDevice ReliabilityMicroelectronicsDielectric BreakdownVlsi Technology TrendsElectrical InsulationElectromagnetic Compatibility
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