Grinding of silicon wafers using an ultrafine diamond wheel of a hybrid bond material

Grinding technology. Theory and applications of machining with abrasives

H. Kaliszer · International Journal of Machine Tools and Manufacture · 1991 · 553 citations

Engineering, Manufacturing Engineering, Mechanical Engineering +5

Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding

Sanjay Agarwal, P. Venkateswara Rao · International Journal of Machine Tools and Manufacture · 2007 · 326 citations

Engineering, Materials Engineering, Materials Science +17

Improved thermal conductivity of epoxy composites using a hybrid multi-walled carbon nanotube/micro-SiC filler

Tianle Zhou, Xin Wang, Xiaoheng Liu et al. · Carbon · 2009 · 282 citations

Natural Sciences, Materials Engineering, Materials Science +16

Experimental investigations of machining characteristics and removal mechanisms of advanced ceramics in high speed deep grinding

Han Huang, Y.C Liu · International Journal of Machine Tools and Manufacture · 2003 · 227 citations

Engineering, Manufacturing Engineering, Materials Science +15

Enhanced Thermal Conductivity of Polymer Matrix Composite via High Solids Loading of Aluminum Nitride in Epoxy Resin

Eunsung Lee, Sang‐Mock Lee, Daniel J. Shanefield et al. · Journal of the American Ceramic Society · 2008 · 220 citations

Natural Sciences, Materials Engineering, Materials Science +17