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Grinding of silicon wafers using an ultrafine diamond wheel of a hybrid bond material

Materials ScienceMaterials EngineeringDiamond-like CarbonSilicon WafersEngineeringWafer Scale ProcessingMaterial ProcessingMicrofabricationHybrid Bond MaterialMechanical EngineeringApplied PhysicsFabrication TechniqueSemiconductor Device FabricationMachiningMicroelectronicsUltrafine Diamond WheelMicrostructure