IEEE Electron Device Letters · 2014 · 88 citations · 10 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsDevice CharacterizationField-effect TransistorsP-n JunctionsSemiconductor ReliabilityWide-bandgap Semiconductor DevicesWide-bandgap SemiconductorsAvalanche BreakdownBreakdown MechanismsBreakdown VoltageDiamond Semiconductor DevicesDiamond SemiconductorsHigh-temperature Device OperationJunction Field-effect TransistorsPositive Temperature Coefficient
Blocking characteristics of diamond junction field-effect transistors were evaluated at room temperature (RT) and 200 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">°</sup> C. A high source-drain bias (breakdown voltage) of 566 V was recorded at RT, whereas it increased to 608 V at 200 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">°</sup> C. The positive temperature coefficient of the breakdown voltage indicates the avalanche breakdown of the device. We found that the breakdown occurred at the drain edge of the p-n junction between p-channel and the n <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">+</sup> -gates. All four devices measured in this letter showed a maximum gate-drain bias over 500 V at RT and 600 V at 200 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">°</sup> C.
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Diamond surface-channel FET structure with 200 V breakdown voltage
P. Gluche, A. Aleksov, Andrei Vescan et al. · IEEE Electron Device Letters · 1997 · 104 citations
Very high temperature operation of diamond Schottky diode
Andrei Vescan, I. Daumiller, P. Gluche et al. · IEEE Electron Device Letters · 1997 · 74 citations