High yield packaging for high-density multi-channel chip integration on flexible parylene substrate

Abstract

This paper reports a new chip packaging technique for the assembly of retinal prosthesis device. Here, a photoresist is used as glue to attach a chip to the targeted parylene-C substrate so that 94% of the chip area is used as attachment to prevent delamination. As a validation, chips with 268 connections were used to assess the connection yield. The results show that this new technique, combined with an additional parylene-C coating, provide a high connection yield (>;90%) and is a promising method for high-lead-count implant devices.