Publication | Closed Access
Investigations of thermal interfaces aging under thermal cycling conditions for power electronics applications
10
Citations
4
References
2011
Year
Thermal Cycling ConditionsElectrical EngineeringEngineeringPower Electronics ApplicationsApplied PhysicsThermal InterfacesThermal AnalysisCircuit ReliabilityThermodynamicsThermal ModelingHeat TransferDevice ReliabilityThermal EngineeringThermal PropertyElectrical Insulation
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