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Atomic layer deposition of gadolinium scandate films with high dielectric constant and low leakage current
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Citations
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References
2006
Year
EngineeringThin Film Process TechnologyChemical DepositionLeakage Current DensityLow LeakageMolecular Beam EpitaxyEpitaxial GrowthAtomic Layer DepositionThin Film ProcessingMaterials EngineeringMaterials ScienceElectrical EngineeringGadolinium Scandate FilmsOxide ElectronicsSemiconductor MaterialMicroelectronicsSemiconductor CapacitorsSurface ScienceApplied PhysicsThin Films
Gd Sc O 3 films were deposited on hydrogenated silicon substrates by atomic layer deposition. The films were pure and amorphous, both as-deposited and after a 5min anneal at 950°C. Cross-sectional transmission electron microscopy revealed a sharp, smooth interface between GdScO3 and Si. Capacitance and leakage current measurements on metal oxide semiconductor capacitors made from atomic layer deposited WN∕GdScO3 stacks showed that the amorphous GdScO3 films have a high dielectric constant (∼22), low fixed charge density, and low interface trap density. A film with 1nm equivalent oxide thickness also demonstrated that the leakage current density is less than 2mA∕cm2 at 1V gate bias.
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