Publication | Closed Access
Impact of Conduit Geometry on the Performance of Typical Particulate Microchip Packings
35
Citations
42
References
2009
Year
EngineeringBiomedical EngineeringSoft MatterAdvanced Packaging (Semiconductors)Conduit GeometryMicroscale SystemElectronic PackagingChromatographic PerformanceMicrofluidicsChromatographyMaterials SciencePacking DensitiesChip On BoardComputer EngineeringChip AttachmentAdvanced PackagingChip-scale PackageMicrofabricationLab-on-a-chip
This work investigates the impact of conduit geometry on the chromatographic performance of typical particulate microchip packings. For this purpose, high-performance liquid chromatography (HPLC)/UV-microchips with separation channels of quadratic, trapezoidal, or Gaussian cross section were fabricated by direct laser ablation and lamination of multiple polyimide layers and then slurry-packed with either 3 or 5 microm spherical porous C8-silica particles under optimized packing conditions. Experimentally determined plate height curves for the empty microchannels are compared with dispersion coefficients from theoretical calculations. Packing densities and plate height curves for the various microchip packings are presented and conclusively explained. The 3 microm packings display a high packing density irrespective of their conduit geometries, and their performance reflects the dispersion behavior of the empty channels. Dispersion in 5 microm packings correlates with the achieved packing densities, which are limited by the number and accessibility of corners in a given conduit shape.
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