A self-compensating 130-GHz wire bond interconnect with 13% bandwidth

Abstract

This paper shows experimental results of a wire bond interconnect for multi-chip modules. The interconnect can be used to connect highly integrated millimeter-wave transceiver ICs with package-integrated off-chip antennas. It uses a half-wavelength long air transmission line that is formed by three parallel wires. Thus a self-matching interconnect is realized that is feasible for frequencies above 100 GHz. Measurement results are shown that prove the high performance with a bandwidth of up to 13%.