Design and measurement of matched wire bond and flip chip interconnects for D-band system-in-package applications

Abstract

This paper reports on possible interconnect solutions between a Silicon MMIC and an off-chip antenna. These shall both be integrated within a plastic package to achieve a 122 GHz system-in-package. Coplanar wire bond and flip chip interconnects are shortly introduced and compared. Simulation and measurement results of matched interconnects are then evaluated in a frequency range between 110 and 170 GHz. A matched 400 μm long wire bond interconnect as well as a self-matching half-wave wire bond are compared to a flip chip interconnect.