Enhanced bias stress stability of a-InGaZnO thin film transistors by inserting an ultra-thin interfacial InGaZnO:N layer

Abstract

Amorphous indium-gallium-zinc oxide (a-IGZO) thin film transistors (TFTs) having an ultra-thin nitrogenated a-IGZO (a-IGZO:N) layer sandwiched at the channel/gate dielectric interface are fabricated. It is found that the device shows enhanced bias stress stability with significantly reduced threshold voltage drift under positive gate bias stress. Based on x-ray photoelectron spectroscopy measurement, the concentration of oxygen vacancies within the a-IGZO:N layer is suppressed due to the formation of N-Ga bonds. Meanwhile, low frequency noise analysis indicates that the average trap density near the channel/dielectric interface continuously drops as the nitrogen content within the a-IGZO:N layer increases. The improved interface quality upon nitrogen doping agrees with the enhanced bias stress stability of the a-IGZO TFTs.