Journal of Vacuum Science and Technology · 1972 · 72 citations · 0 references
Natural SciencesMaterials EngineeringMaterials ScienceElectronic MaterialsMetallic MaterialsMetallurgyElectrical ConductivityMetalsSemiconductor ReliabilityThin Film Electrical PropertiesActivation EnergyActivation Energy DeterminationAluminum-containing AlloysElectromigrationElectromigration AnalysisElectromigration ReliabilityFilm Breakdown MechanismsMaterial Degradation Mechanisms
Views Icon Views Article contents Figures & tables Video Audio Supplementary Data Peer Review Share Icon Share Twitter Facebook Reddit LinkedIn Tools Icon Tools Reprints and Permissions Cite Icon Cite Search Site Citation F. M. d'Heurle, N. G. Ainslie, A. Gangulee, M. C. Shine; Activation Energy for Electromigration Failure in Aluminum Films Containing Copper. Journal of Vacuum Science and Technology 1 January 1972; 9 (1): 289–293. https://doi.org/10.1116/1.1316583 Download citation file: Ris (Zotero) Reference Manager EasyBib Bookends Mendeley Papers EndNote RefWorks BibTex toolbar search Search Dropdown Menu toolbar search search input Search input auto suggest filter your search All ContentAVS: Science & Technology of Materials Interfaces and ProcessingJournal of Vacuum Science and Technology Search Advanced Search |Citation Search