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Activation Energy for Electromigration Failure in Aluminum Films Containing Copper
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1972
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Aluminium NitrideEngineeringMaterial InnovationVacuum DeviceCorrosionElectromigration FailureElectrochemical InterfaceMaterials EngineeringMaterials ScienceElectrical EngineeringElectromigration TechniqueMaterial PropertyElectrochemistryElectronic MaterialsMaterials CharacterizationApplied PhysicsSurface ScienceVacuum ScienceMaterial PerformanceActivation EnergyElectrical Insulation
Views Icon Views Article contents Figures & tables Video Audio Supplementary Data Peer Review Share Icon Share Twitter Facebook Reddit LinkedIn Tools Icon Tools Reprints and Permissions Cite Icon Cite Search Site Citation F. M. d'Heurle, N. G. Ainslie, A. Gangulee, M. C. Shine; Activation Energy for Electromigration Failure in Aluminum Films Containing Copper. Journal of Vacuum Science and Technology 1 January 1972; 9 (1): 289–293. https://doi.org/10.1116/1.1316583 Download citation file: Ris (Zotero) Reference Manager EasyBib Bookends Mendeley Papers EndNote RefWorks BibTex toolbar search Search Dropdown Menu toolbar search search input Search input auto suggest filter your search All ContentAVS: Science & Technology of Materials Interfaces and ProcessingJournal of Vacuum Science and Technology Search Advanced Search |Citation Search