Publication | Closed Access
The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects
80
Citations
16
References
2010
Year
Materials ScienceEngineeringAdvanced Packaging (Semiconductors)Mechanical BehaviorMechanicsStretchable InterconnectsMechanical EngineeringDeformation BehaviorChip AttachmentFailure MechanismsElectronic PackagingMechanical DeformationMechanics Of Materials
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