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Design and optimization of thermo-mechanical reliability in wafer level packaging

Materials ScienceReliability EngineeringEngineeringChip-scale PackageAdvanced Packaging (Semiconductors)Hardware ReliabilityPhysic Of FailureMechanical EngineeringChip AttachmentElectronic PackagingHeat TransferMicroelectronicsThermal EngineeringMechanics Of MaterialsWafer Level Packaging