Optical and Electronic Packaging Processes for Silicon Photonic Systems

Abstract

Fiber optic interconnection processes and hybrid integration of electronic devices for high speed Si photonic systems are presented. Thermal effects arising from these hybrid integration processes are also investigated. An overview of ePIXfab which offers affordable access to an advanced Si photonic foundry service is also presented. This includes the presentation of fundamental photonic packaging design rules which can greatly reduce the time and cost associated with the development of complex Si photonic devices.