IEEE Photonics Technology Letters · 2015 · 25 citations · 13 references
EngineeringElectrical EngineeringOptoelectronicsPhotonicsSensorsIntegrated PhotonicsOptical SensorsPhotonic Integrated CircuitsTemperature MeasurementTemperature SensorsThermal SensorsAdvanced PackagingCmos Fabrication ProcessesFiber-optic SensorsFiber-optic Temperature SensorsMichelson InterferometerOptical ThermometryTemperature SensingTemperature Sensor Packaging
A photonic thermal sensor has been demonstrated using photonic waveguide-based Michelson interferometer (MI), with a footprint of only 120 μm × 80 μm. Operating at the wavelength ~1550 nm, this ultracompact MI configuration obtains a nearly linear temperature response with a sensitivity of 113.7 pm/°C, which is ~20 times higher than that of traditional fiber-optic thermal sensors. It is fabricated using standard CMOS processes. Benefitted from the advanced packaging technique, the proposed photonics sensor shows high thermal and mechanical stabilities, presenting a <;0.1-dB power variation over the temperature range of 13 °C-95 °C, offering possibilities across a broad range of applications.
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Fast and low power Michelson interferometer thermo-optical switch on SOI
Junfeng Song, Qing Fang, Shaohua Tao et al. · Optics Express · 2008 · 100 citations · Full text