Temperature Sensor Packaging

Temperature Sensor Packaging is a specialized method in sensor engineering that integrates temperature-sensing elements with protective materials and structural interfaces to ensure environmental stability, signal integrity, and compatibility with external systems while maintaining precise thermal responsiveness.

45

Publications

1.4K

Citations

221

Authors

81

Institutions

Publications per year

2017–2026

16

Authors

221

  1. KA
    Kofi A. A. Makinwa

    Delft University of Technology, Netherlands

    3 publications · 128 citations

    3

    h-index

  2. LV
    Lubos Vacik

    Baker Hughes (United States), United States

    2 publications · 45 citations

    2

    h-index

  3. JA
    Joseph A. Potkay

    University of Michigan, United States

    2 publications · 146 citations

    2

    h-index

  4. SL
    Silviu Livescu

    Baker Hughes (United States), United States

    2 publications · 45 citations

    2

    h-index

  5. DB
    Diego Blanco

    Baker Hughes (United States), United States

    2 publications · 45 citations

    2

    h-index

1–5 of 221

Venues

  1. Sensors and Actuators A Physical

    4 publications · 83 citations

    4

    h-index

  2. IEEE photonics journal

    2 publications · 22 citations

    2

    h-index

  3. Sensors

    2 publications · 124 citations

    2

    h-index

  4. Measurement Science and Technology

    2 publications · 36 citations

    2

    h-index

  5. IEEE Photonics Technology Letters

    IPTEL · 1 publications · 25 citations

    1

    h-index

1–5