Publication | Closed Access
Lateral epitaxy of low defect density GaN layers via organometallic vapor phase epitaxy
651
Citations
11
References
1997
Year
Materials ScienceMaterials EngineeringHigh DensityWide-bandgap SemiconductorEngineeringSemiconductor TechnologyCrystalline DefectsSurface ScienceApplied PhysicsAluminum Gallium NitrideLateral EpitaxyGan Power DeviceMultilayer HeterostructuresGan StripesCategoryiii-v SemiconductorGan Layers
Organometallic vapor phase lateral epitaxy and coalescence of GaN layers originating from GaN stripes deposited within 3-μm-wide windows spaced 3 μm apart and contained in SiO2 masks on GaN/AlN/6H–SiC(0001) substrates are reported. The extent and microstructural characteristics of the lateral overgrowth were a strong function of stripe orientation. A high density of threading dislocations, originating from the interface of the underlying GaN with the AlN buffer layer, were contained in the GaN grown in the window regions. The overgrowth regions, by contrast, contained a very low density of dislocations. The coalesced layers had a rms surface roughness of 0.25 nm.
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