Strain and tilt mapping in silicon around copper filled TSVs using advanced X-ray nano-diffraction - Concepedia

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Strain and tilt mapping in silicon around copper filled TSVs using advanced X-ray nano-diffraction

13

Citations

16

References

2014

Year

B. Vianne, S. Escoubas, Marie‐Ingrid Richard, S. Labat, Gilbert Chahine, T. Schülli, A. Farcy, P. Bar, Vincent Fiori

Microelectronic Engineering

Materials ScienceNanoscale ScienceEngineeringSevere Plastic DeformationPhysicsSurface ScienceApplied PhysicsSemiconductor Device FabricationTilt MappingAdvanced X-ray Nano-diffractionMicroelectronicsSilicon On InsulatorMicrostructure

References

	Year	Citations

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