Thermally Stable Transparent Resistive Random Access Memory based on All‐Oxide Heterostructures

Abstract

An all‐oxide transparent resistive random access memory (T‐RRAM) device based on hafnium oxide (HfO x ) storage layer and indium‐tin oxide (ITO) electrodes is fabricated in this work. The memory device demonstrates not only good optical transmittance but also a forming‐free bipolar resistive switching behavior with room‐temperature R OFF / R ON ratio of 45, excellent endurance of ≈5 × 10 7 cycles and long retention time over 10 6 s. More importantly, the HfO x based RRAM carries great ability of anti‐thermal shock over a wide temperature range of 10 K to 490 K, and the high R OFF / R ON ratio of ≈40 can be well maintained under extreme working conditions. The field‐induced electrochemical formation and rupture of the robust metal‐rich conductive filaments in the mixed‐structure hafnium oxide film are found to be responsible for the excellent resistance switching of the T‐RRAM devices. The present all‐oxide devices are of great potential for future thermally stable transparent electronic applications.