Creep phenomena in lead-free solders

Creep in metallic materials

J. Čadek · Materials science monographs · 1988 · 580 citations

Natural Sciences, Materials Engineering, Materials Science +11

Constitutive relations for tin-based solder joints

Robert Darveaux, K. Banerji · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1992 · 469 citations

Natural Sciences, Materials Engineering, Materials Science +17

Metallurgy of low temperature Pb-free solders for electronic assembly

J. Glazer · International Materials Reviews · 1995 · 416 citations

Natural Sciences, Materials Engineering, Materials Science +13

Characterization of eutectic Sn-Bi solder joints

Z. Mei, J. W. Morris · Journal of Electronic Materials · 1992 · 315 citations

Natural Sciences, Materials Engineering, Materials Science +8

Microstructure evolution of eutectic Sn-Ag solder joints

Wenge Yang, Robert W. Messler, L.E. Felton · Journal of Electronic Materials · 1994 · 272 citations

Natural Sciences, Materials Engineering, Materials Science +14