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Evolutionary phase diagrams for plasma-enhanced chemical vapor deposition of silicon thin films from hydrogen-diluted silane
152
Citations
15
References
1999
Year
Phase DiagramsEngineeringThin Film Process TechnologySilicon On InsulatorHydrogen-diluted SilanePlasma ProcessingPhotovoltaicsSemiconductorsThin Film ProcessingThin-film TechnologyMaterials ScienceCrystalline DefectsEvolutionary Phase DiagramsReal-time Optical StudiesSemiconductor Device FabricationChemical Vapor DepositionSurface ScienceApplied PhysicsThin FilmsSilicon Thin FilmsSolar Cell Materials
Real-time optical studies have been applied to develop phase diagrams that characterize plasma-enhanced chemical vapor deposition (PECVD) of silicon thin films at low temperature (200 °C). The deposition phase diagrams describe regimes over which predominantly amorphous and microcrystalline Si phases are obtained as a function of the accumulated thickness and the hydrogen-to-silane gas flow ratio R=[H2]/[SiH4] in the PECVD process. The diagrams for different substrates provide insights into optimization of amorphous Si materials and solar cells.
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