A modeling methodology for thermal analysis of the PCB structure

<i>Computational Methods for Fluid Dynamics</i>

Joel H. Ferziger, Milovan Perić, Anthony Leonard · Physics Today · 1997 · 6K citations

Natural Sciences, Computational Engineering, Mathematics +16

HotSpot: a compact thermal modeling methodology for early-stage VLSI design

Wei Huang, Sudeep Ghosh, S. Velusamy et al. · IEEE Transactions on Very Large Scale Integration (VLSI) Systems · 2006 · 1.1K citations

Engineering, Computer Engineering, Heat Transfer +16

Thermal analysis of multiple-layer structures

Achilles G. Kokkas · IEEE Transactions on Electron Devices · 1974 · 166 citations

Engineering, Electrical Engineering, Heat Transfer +16

The current distribution and AC resistance of a microstrip structure

Reza Faraji‐Dana, Y.L. Chow · IEEE Transactions on Microwave Theory and Techniques · 1990 · 107 citations

Engineering, Electrical Engineering, Circuit Theory +16

Experimental determination of thermal conductivity of printed wiring boards

K. Azar, J. E. Graebner · 2002 · 99 citations

Natural Sciences, Electrical Engineering, Materials Science +13