Publication | Closed Access
Quantitative Analysis of Tunneling Current through Ultrathin Gate Oxides
62
Citations
6
References
1995
Year
Oxide HeterostructuresSio 2Electrical EngineeringSemiconductor TechnologyEngineeringTunneling MicroscopyNanoelectronicsStress-induced Leakage CurrentOxide SemiconductorsQuantitative AnalysisTunnelingApplied PhysicsOxide ElectronicsV OxDirect Tunneling RegionMicroelectronicsSemiconductor Device
The tunneling current through ultrathin (3.0-6.0 nm) gate oxides has been measured as a function of the voltage across SiO 2 , V OX , and compared with results of existing theories utilizing the WKB approximation. The electron effective mass in the Fowler-Nordheim tunneling region ( V OX ≥3.25 V) is obtained to be (0.34±0.04) m 0 and that in the direct tunneling region ( V OX <3.25 V) is (0.29±0.02) m 0 . It is also shown that the charge-to-breakdown for electron injection from n + poly-Si gates is not significantly degraded by decreasing the oxide thickness and is even dramatically improved for the case of a 3.0 nm-thick gate oxide.
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