Signal analysis of CMP process based on AE monitoring system

Grinding Monitoring System Based on Power and Acoustic Emission Sensors

Bernhard Karpuschewski, M. Wehmeier, Ichiro INASAKI · CIRP Annals · 2000 · 119 citations

Monitoring Technology, Condition Monitoring, Engineering +5

Multi-Sensor Monitoring System in Chemical Mechanical Planarization (CMP) for Correlations with Process Issues

Haedo Jeong, Hyun Suk Kim, Steven Lee et al. · CIRP Annals · 2006 · 41 citations

Monitoring Technology, Sensor Application, Engineering +15

Mathematical model-based evaluation methodology for environmental burden of chemical mechanical planarization process

Hyunseop Lee, David Dornfeld, Haedo Jeong · International Journal of Precision Engineering and Manufacturing-Green Technology · 2014 · 29 citations · Full text

Process Integration, Process Design, Engineering +11

Bicepstrum based blind identification of the acoustic emission (AE) signal in precision turning

Aitzol Iturrospe, David Dornfeld, Vicente Atxa et al. · Mechanical Systems and Signal Processing · 2004 · 25 citations

Aeroacoustics, Kinesiology, Engineering +9

Acoustic emission monitoring for the diamond machining of oxygen-free high-conductivity copper

Yoon Lee, Andrew Chang, David Dornfeld · Journal of Materials Processing Technology · 2002 · 20 citations

Materials Science, Acoustic Emission Monitoring, Oxygen-free High-conductivity Copper +5