Journal of Applied Physics · 2009 · 155 citations · 21 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsSemiconductor Device MaterialsSemiconductor SurfacesSilicon MaterialsSolar Cell MaterialsSolar CellsSurface PassivationCrystalline SiliconCrystalline Silicon Solar CellsPassivationSiliconSilicon PassivationSurface Passivation LayersSurface RecombinationSurface Stability
The thermal and ultraviolet (UV) stability of crystalline silicon (c-Si) surface passivation provided by atomic layer deposited Al2O3 was compared with results for thermal SiO2. For Al2O3 and Al2O3/a-SiNx:H stacks on 2 Ω cm n-type c-Si, ultralow surface recombination velocities of Seff<3 cm/s were obtained and the passivation proved sufficiently stable (Seff<14 cm/s) against a high temperature “firing” process (>800 °C) used for screen printed c-Si solar cells. Effusion measurements revealed the loss of hydrogen and oxygen during firing through the detection of H2 and H2O. Al2O3 also demonstrated UV stability with the surface passivation improving during UV irradiation.
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Silicon surface passivation by atomic layer deposited Al2O3
Bram Hoex, Jan Schmidt, Peter Pohl et al. · Journal of Applied Physics · 2008 · 474 citations · Full text