IEEE Transactions on Dielectrics and Electrical Insulation · 2015 · 52 citations · 17 references
EngineeringMaterials EngineeringMaterials ScienceHeat TransferThermal AnalysisThermodynamicsDecomposition AnalysisHeat ConductionHeat Transfer AnalysisHeat Transfer FundamentalsThermal History AnalysisThermal ManagementDecomposition MechanismsExperimental Thermal AnalysisTemperature DiagnosticsThermal DecompositionThermal Decomposition ReactionsThermal Degradation StudiesThermal Fault Detection
To explore the influence mechanism of trace H <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O on SF6 decomposition characteristics under partial thermal fault and establish the foundation of using SF6 thermal decomposition principle to diagnose the thermal fault of SF <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">6</sub> electrical equipment, a series of artificial thermal fault decomposition experiments with different H <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O concentrations were conducted on the designed SF6 thermal decomposition experimental system. A trace water injector was used to control the content of trace H2O accurately and gas chromatograph, chromatography-mass spectrometry as well as Fourier transform infrared spectroscopy were used to measure decomposed components. Finally, the thermal decomposition characteristic under 340 ° was achieved. The analysis results indicate no matter how much H <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O content is, SF <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">6</sub> can decomposes into many kinds of decomposition characteristics, such as CO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> , SOF <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> , SO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> , SOF <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">4</sub> , SO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> F <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> , H <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> S, HF. The concentrations of all these decomposition characteristics increase with the time extended, but change differently with the increase of H <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O content, because H <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O plays different role in the formation process of each decomposition characteristic components. The variation of H <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O content not only affects the production of the decomposition characteristic components, but also makes SO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> and HF gradually evolved into the main characteristic components of SF <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">6</sub> thermal decomposition. In addition, the higher the H <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O content is, the stronger the promoting effect on SO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> and HF is.
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Ju Tang, Fan Liu, Xiaoxing Zhang et al. · IEEE Transactions on Dielectrics and Electrical Insulation · 2012 · 258 citations