Journal of Physics E Scientific Instruments · 1970 · 39 citations · 4 references
Natural SciencesMaterials EngineeringMaterials ScienceMetallic MaterialsSurface ScienceThin FilmsAdhesive BondingThin Film AdhesionThin Film Mechanical PropertiesThin-film MaterialsAdhesion MechanismsAdhesion StrengthAdhesion To GlassAdhesion To MetalsFilm AdhesionInterfacial AdhesionMetal Film AdhesionMetallic Thin Films
An apparatus is described which has proved of use in the investigation of the adhesion of thin metallic films to glass substrates. A rod is cemented with its axis perpendicular to the surface of the film and a lateral force is applied to the other end of the rod to break the bond. The magnitude of the couple causing film to become detached from the substrate provides a measure of the film adhesion. Tensile stresses in excess of 4 × 107 N m−2 can be obtained.
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