Hollow cathode discharge sputtering device for uniform large area thin film deposition

H. Koch, L. J. Friedrich, V. Hinkel, Frank Ludwig, B. Politt, T. Schurig

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1991 · 44 citations · 0 references

Concepts

Abstract

Hollow cathode discharges produce higher densities of sputtered particles than conventional discharges and can be utilized for thin film deposition. A prototype hollow cathode sputter source has therefore been built and tested. The deposition of copper and the superconductor YBa2Cu3O7−x produced thin films of good quality. The method can be upscaled for a uniform deposition of tapes, wires, large-area substrates, and for the parallel deposition of multiple substrates.