Characterizations of super hard Cu films containing insoluble W prepared by sputter deposition

Properties of reactively sputtered WN x as Cu diffusion barrier

Bong-Seok Suh, Yoon-Jik Lee, Jeongsug Hwang et al. · Thin Solid Films · 1999 · 57 citations

Natural Sciences, Materials Engineering, Materials Science +13

Thermal conductivity and thermal expansion of graphite fiber-reinforced copper matrix composites

David L. Ellis, D. L. Mcdanels · Metallurgical Transactions A · 1993 · 50 citations

Natural Sciences, Materials Engineering, Materials Science +16

Deposition, microstructure and properties of sputtered copper films containing insoluble molybdenum

Jinn P. Chu, Tyson Lin · Journal of Applied Physics · 1999 · 38 citations

Natural Sciences, Materials Engineering, Materials Science +17

Microstructure and properties of Cu-C pseudoalloy films prepared by sputter deposition

Jinn P. Chu, P. Y. Lee, Chan‐Hwa Chung et al. · Metallurgical and Materials Transactions A · 1998 · 36 citations

Natural Sciences, Materials Engineering, Materials Science +14

Evolution of microstructure in nanocrystalline Mo-Cu thin films during thermal annealing

Ganpati Ramanath, H. Z. Xiao, Ling Yang et al. · Journal of Applied Physics · 1995 · 32 citations

Natural Sciences, Materials Engineering, Materials Science +17